INCERAM at SES 2026 — A Strong Presence at India's Strategic Electronics Summit

INCERAM Innovations LLP successfully exhibited at SES 2026 — the 15th Strategic Electronics Summit, held on 23–24 July 2026 at BIEC, Bengaluru. Organized by ELCINA, SES is India's premier platform bringing together technology companies, system integrators, OEMs, and representatives of the armed forces and government agencies working on next-generation defence, aerospace, drone, and security electronics.

At our booth, we showcased INCERAM's full range of ceramic PCB and packaging capabilities — from laser and diamond dicing to thick film and thin film metallization, direct bonded copper, Ni/Au/ENIG/ENIPIG/Ag finishes, die attach and wire bonding, and sealing and encapsulation. Visitors explored our portfolio of ceramic substrates and submounts, microheaters, metallized sensors, thermal interfaces, and hybrid microassemblies — solutions engineered for the high-reliability, high-temperature, and harsh-environment demands of defence and aerospace electronics.

Over two days, we had the opportunity to connect with engineers, procurement specialists, and system developers from across India's strategic electronics ecosystem — conversations that reinforced the strong and growing demand for advanced, locally manufactured ceramic packaging solutions.

We were also honored to receive an official Certificate of Appreciation from ELCINA recognizing INCERAM's participation as an Exhibitor at SES 2026 — a meaningful milestone as we build our presence in India's electronics manufacturing landscape.

Thank you to ELCINA for organizing an outstanding event, and to everyone who visited our booth. We look forward to continuing these conversations and to our next opportunity to connect with the community at future editions of SES.