Company
Some designs are too precise, too compact, or too specialized for anything a catalog can offer. We develop and manufacture custom hybrid micromodules — built on metallized ceramic substrates, these modules integrate passive structures, semiconductor dies, and interconnects into a compact, reliable, and application-specific solution.
We provide full-cycle development and manufacturing — from concept and design optimization to assembly, sealing, and testing — ensuring the best balance between performance, reliability, and cost.
HIGH INTEGRATION
All-in-one Module
CUSTOM DESIGN
Engineered per Spec
HARSH READY
Stable Under Stress
FULL CYCLE
Design to Test
Hybrid microassemblies on ceramic substrates represent the intersection of maximum miniaturization and maximum reliability. Unlike conventional assemblies, ceramic hybrids carry circuitry directly on the substrate. The result is a mechanically robust, thermally stable, hermetically sealable module capable of operating across extreme temperature ranges, under vibration, and in vacuum.
A key advantage of hybrid technology is the ability to integrate multiple functions into a single compact structure — including printed resistors, interconnects, semiconductor dies, and other elements. Combined with precision processing, wire bonding, and controlled assembly, this enables highly optimized solutions tailored to specific electrical, thermal, and mechanical requirements.
Our engineering approach focuses on early-stage collaboration, where we help optimize layout, material selection, and manufacturing technology to achieve the best technical and commercial outcome.
| Parameter | Typical Capability |
|---|---|
| Substrate materials | Al₂O₃, AlN, Si₃N₄, other materials |
| Technologies | Thick film, thin film, DBC, hybrid combinations |
| Resistor range | 1 Ω/sq to 100 GΩ/sq |
| Die attach | Epoxy, solder |
| Wire bonding | Al, Au, Pt; ultrasonic / thermocompression |
| Encapsulation | Epoxy, glass, solder, laser sealing |
| Testing | Electrical, thermal cycling, vibration, leak |
Can you develop the hybrid microassembly from scratch, or do I need to provide a complete design?
Both scenarios are welcome. We can work from a functional specification, an existing schematic, or a complete layout. Our engineering team handles substrate selection, DFM review, technology choice, and prototype fabrication. You describe what the circuit needs to do and the environment it will operate in — we design the assembly around that.
What is the minimum order quantity for custom hybrid microassemblies?
There is no fixed minimum. We regularly produce single prototypes and engineering samples, as well as small series from a few pieces to several hundred. Cost per unit reflects tooling amortization over quantity; we will always advise on the most cost-effective path.
How do I choose between thin-film and thick-film technology?
The decision depends on several factors. Thin-film is preferred for circuits above ~1 GHz, wherever tight conductor geometry is required, or when resistor precision and temperature stability are critical. Thick-film is the better choice for mixed-signal and power-tolerant designs, multilayer interconnects, and applications where cost efficiency matters more than ultimate precision. For many designs a combination of both makes sense — and we are comfortable recommending and executing that.
Can you mount SiC bare die or other advanced semiconductors?
Yes. We mount all types of bare die, including SiC and GaN devices, using epoxy or solder die attach, and we bond with aluminum or gold wire by ultrasonic or thermocompression methods.
What ceramic substrate is best for my application?
It depends on your thermal, electrical, mechanical, and frequency requirements. Standard alumina is a cost-effective baseline for most applications. AlN and Si₃N₄ are chosen for high thermal conductivity where heat must be extracted from the circuit. We will recommend the right material once we understand your design requirements.
Do you perform testing and qualification of finished assemblies?
Yes. Electrical parameter testing is standard. Vibration testing, thermal cycling, and hermeticity testing are available per customer requirements, including per MIL-spec or customer-specific procedures.
Submit Your Request
Please fill out the form and provide as much detail as possible. The more information you share, the more efficient our response will be.
Review & Clarification
We carefully review your specifications and may contact you for clarification. We provide as much cooperation and communication as your project requires.
Tailored Quotation
You will receive a competitive offer including pricing, estimated lead times, technical details, and, if relevant, alternative solutions.
Ongoing Support
After confirmation, we stay with you throughout production, delivery, and product use — ensuring reliable service and long-term cooperation.
Strategic Electronics Summit · BIEC, Bengaluru
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