Company
When the right power module does not exist in any catalog — or when a standard module falls short on voltage, current, thermal performance, or environmental ruggedness — we build it. We design and manufacture custom power assemblies and multi-chip power modules (MCMs) on metallized ceramic substrates, supporting working voltages up to 2000 V and currents up to 1800 A. Based on diodes, thyristors, MOSFETs, IGBTs, and SiC devices, each module is engineered for your specific electrical, thermal, and mechanical requirements — not adapted from a mass-market design.
View DetailsHIGH POWER
Up to 2000 V
THERMAL DESIGN
Heat Under Control
CUSTOM MODULES
No Standard Limits
ROBUST BUILD
Harsh Environments
A custom power module is often the only engineering solution. Standard commercial modules are optimized for the broadest possible market, which means they are a compromise in voltage class, current rating, footprint, thermal interface, and package form factor. When your application requires a specific combination that no catalog covers — whether it is a non-standard voltage/current combination, a unique package geometry, integration of custom control circuitry with the power stage, or operation in a harsh environment that would degrade standard plastic-encased modules — a purpose-built solution is the only path forward.
Our power assembly process starts with the substrate. We provide options with thick copper metallization (0.125–0.8 mm) on ceramic: alumina (Al₂O₃) as the cost-effective baseline; ZTA (zirconia-toughened alumina) for improved fracture toughness and thermal cycling life; aluminum nitride (AlN) for high thermal conductivity where heat removal is the design constraint; and silicon nitride (Si₃N₄) for applications demanding the highest combination of thermal performance and mechanical strength, particularly under aggressive thermal cycling conditions typical of traction and aerospace applications.
On these substrates we mount power semiconductor die — diodes, thyristors, bipolar transistors, MOSFETs, IGBTs, and SiC devices — using solder die attach, eutectic die attach, or conductive epoxy, depending on the thermal budget and reliability requirements. Interconnection is made by ultrasonic aluminum wire bonding (30–500 µm diameter), gold wire bonding (30–50 µm), or aluminum ribbon bonding for high-current power paths. Signal and power leads are attached and the completed assembly is sealed in metal-ceramic or metal-polymer housings, with sealing by solder, adhesive systems, or thermal putting.
The result is a module built to your electrical specification, fitted to your mechanical envelope, compatible with your thermal interface, and qualified to the environmental conditions your application demands — extended temperature range, shock, vibration, thermal cycling, and hermeticity as required. We support the complete cycle from design concept through qualification and series manufacturing.
| Parameter | Typical Capability |
|---|---|
| Substrate materials | Al₂O₃, AlN, ZTA, Si₃N₄ |
| Metallization | Thick Cu ~125–800 µm |
| Operating voltage | Up to ~2000 V |
| Current handling | Up to ~1800 A |
| Die attach | Solder, epoxy, eutectic |
| Wire bonding | Al (30–500 µm), Au (30–50 µm) |
| Assembly | Die + packaged components |
| Encapsulation | Epoxy, solder, glass, sealed housings |
| Testing | Thermal cycling, vibration, electrical |
We need a power module that matches a specific unit which is no longer available. Can you reproduce it?
Yes. Provide the original datasheet, a sample if available, and the application context. We will engineer a functional equivalent, adapted to available semiconductor devices and substrate materials, and where possible improve on the original's performance or environmental rating.
What is the minimum order quantity for a custom power module?
We work from single engineering prototypes through small and medium series. There is no hard minimum. Tooling and non-recurring engineering (NRE) costs are discussed upfront so you know the economics before committing.
How do you select the right ceramic substrate material for our application?
The key variables are power dissipation (thermal resistance budget), isolation voltage, expected thermal cycling profile, mechanical stress, and cost target. Al₂O₃ is the starting point for cost-sensitive designs. AlN is chosen when thermal resistance is the binding constraint. Si₃N₄ is specified for the highest reliability under repeated thermal cycling and mechanical shock, typical in traction and aerospace. ZTA is a cost-effective step up from alumina where cycling life matters. We will make a substrate recommendation once we understand your thermal and environmental requirements.
Can you design the module, or do we need to provide a complete electrical design?
We offer a full design service. Starting from your electrical requirements (topology, voltage, current, switching frequency, operating temperature range), we develop the schematic, substrate layout, thermal model, and package design. Customers may also provide a complete or partial design for us to review and manufacture.
Do you support SiC-based power modules?
Yes. We have processes qualified for SiC die attach and wire bonding. SiC devices often demand tighter control of die attach void fraction and thermal interface — we address this with process controls and inspection. The combination of SiC devices and high-thermal-conductivity AlN or Si₃N₄ substrates delivers the best performance in high-frequency, high-temperature applications.
What environmental standards can your assemblies meet?
We design and test to customer-specified standards. Assemblies can be qualified for extended temperature range (typically –60°C to +175°C operating), mechanical shock and vibration per relevant military or industrial standards, and hermetic sealing. Specific qualification requirements are agreed at the design stage.
Submit Your Request
Please fill out the form and provide as much detail as possible. The more information you share, the more efficient our response will be.
Review & Clarification
We carefully review your specifications and may contact you for clarification. We provide as much cooperation and communication as your project requires.
Tailored Quotation
You will receive a competitive offer including pricing, estimated lead times, technical details, and, if relevant, alternative solutions.
Ongoing Support
After confirmation, we stay with you throughout production, delivery, and product use — ensuring reliable service and long-term cooperation.
Strategic Electronics Summit · BIEC, Bengaluru
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