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Thick film microcircuits are hybrid electronic circuits fabricated by screen-printing conductive, resistive, and dielectric pastes onto ceramic substrates and firing them at high temperatures. This mature and highly reliable technology enables compact electronic modules capable of operating in harsh environments where conventional PCB solutions are not suitable.
Thick film technology provides a versatile platform for integrating resistors, conductors, heaters, sensors, and interconnects directly onto ceramic substrates, making it widely used in industrial electronics, automotive systems, power modules, and aerospace applications.
PRECISION PRINTING
Fine Conductor & Resistor Layouts
COMPLEX CIRCUITRY
Multilayer Integration
HARSH ENVIRONMENT
Heat, Chemicals, Vibration
CUSTOM SOLUTIONS
No‑One‑Else Options
Thick film circuits are manufactured by depositing functional pastes — conductive, resistive, and dielectric — onto ceramic substrates (such as alumina, aluminum nitride, zirconia, silicon nitride, etc.) using precision screen-printing processes. After printing, the layers are fired in a high-temperature furnace, typically around 850 °C, forming durable and stable electronic structures bonded directly to the ceramic surface.
Multiple printed layers can be stacked to create complex circuits that include signal routing, printed resistors, heating elements, contact pads, and protective dielectric coatings. Laser trimming can be used to precisely adjust resistor values, enabling tight electrical tolerances and consistent circuit performance.
Because ceramic substrates provide excellent electrical insulation, thermal stability, and chemical resistance, thick film microcircuits perform reliably in demanding environments where organic PCB materials may degrade. They also enable compact hybrid assemblies by combining passive circuitry with discrete components, semiconductor dies, or sensors on the same ceramic platform.
This technology is widely used when applications require a combination of thermal stability, electrical performance, and mechanical durability, particularly in industrial control electronics, power electronics, automotive systems, sensors, and aerospace equipment.
| Parameter | Specification / Range | Notes / Remarks |
|---|---|---|
| Substrate Materials | Alumina 96%, Alumina 99.6%, AlN, Si₃N₄, Sapphire, Zirconia, Quartz Ceramics, High-K Dielectrics | Choice depends on thermal performance, cost, and dielectric needs |
| Substrate Thickness | 0.127 ~ 2.5 mm (typical) | Can be customized for mechanical stability and thermal requirements |
| Thickness Tolerances | As fired: ±10% (standard), ±7% (premium); Lapped: ±0.02 mm | Higher precision tolerances on request |
| Pattern Tolerance | Printed: ±0.05 mm; Photo-imaged: ±0.02 mm | Dimensional precision of conductor patterns |
| Line Width / Space | Min: 50 µm; Typical: 150 µm | Standard screen-printed resolution |
| Line / Tolerance | Min tolerance: ±25 µm; Typical: ±50 µm | Higher resolution achievable upon request |
| Typical Fired Film Thickness | Fine Au: 8–12 µm; Normal: 5–8 µm; Max: 4–18 µm | Thickness range for fired metallised layers |
| Minimum Metallisation Clearance Around Vias | Via dia. + 100 µm | Design rule for via isolation |
| Via Aspect Ratio (typical) | 0.3:1 (hole dia : substrate thickness) | Manufacturability parameter for thru-holes |
| Typical Hole Size (Thru-holes) | ~75% of substrate thickness | Relation between hole diameter and board thickness |
| Resistors – Sheet Value Range | 10–100 Ω/sq | Standard resistor material range |
| Resistor Tolerance Achievable | ±0.30 Ω | Laser trimming capability |
| Minimum Resistor Dimension | 0.250 mm | Physical limit for resistor patterns |
| Minimum Probe Point Size | 0.125 × 0.125 mm (preferably >0.25 mm) | Test pad design guideline |
| Maximum Probe to Resistor Spacing | 20 mm | Layout constraint for reliable probing |
| Maximum Substrate Size | 114.30 × 114.30 mm | Largest practical board size |
| Design File Formats Supported | DWG, DXF, Gerber, GDSII | AutoCAD preferred |
| Laser Machining Tolerances | ±30 µm (feature & position) | Precision for cutouts and markings |
| Minimum Laser Feature to Pattern Gap | 30 µm | Critical for high-density layouts |
| Diamond Sawing Limits | Max substrate thickness: 2.0 mm | Mechanical singulation capability |
| Maximum Dicing Dimensions | Rectangular: 127 × 127 mm; Circular: Ø150 mm | Panel size limits |
| Metallisation Options | Au, Pt/Au, Pt/Ag/Pd, Ag/Pd, Mo/Mn | Depends on solderability and bonding needs |
| Solder Options | Au/Sn, Sn/Ag | Pre-deposited or printed |
| Other Features | Wrap-over edges, multilayers, double-sided, thru-hole printing, passive mounting, wire bonding | Flexible design features for complex circuits |
What are thick film microcircuits?
Thick film microcircuits are hybrid electronic circuits created by printing functional materials onto ceramic substrates. The printed layers form conductors, resistors, and insulation directly on the ceramic base
When should thick film technology be used instead of conventional PCBs?
Thick film microcircuits are preferred when electronics must operate at higher temperatures, in harsh environments, or when integrated resistors and compact hybrid assemblies are required.
Are there customization options?
Absolutely — substrate materials, metallization schemes (e.g., Au, Ag, Pd), resistor values, line features, and post‑processing can all be tailored to meet specific performance and assembly needs.
Can resistors be integrated into the circuit?
Yes. One of the main advantages of thick film technology is the ability to print resistors directly on the ceramic substrate and adjust their values through laser trimming.
Are multilayer circuits possible?
Yes. Multiple conductive and dielectric layers can be printed and fired sequentially, enabling complex circuit architectures and higher integration density.
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