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Thin film microcircuits deliver the ultimate combination of precision, signal integrity, and miniaturization on ceramic substrates. Using vacuum deposition and photolithographic patterning, conductor lines, resistive elements, and functional layers are defined with sub-micron control — enabling high-density, high-frequency circuits.
INCERAM manufactures thin film microcircuits on alumina (Al₂O₃), aluminum nitride (AlN), and other advanced ceramics for RF, microwave, optoelectronic, aerospace, and precision instrumentation applications.
RF PERFORMANCE
Low Loss Structures
RELIABLE INTERCONNECTS
Solid Through-Holes
DESIGN FREEDOM
Any Geometry
MIS-READY CAVITIES
Precision pockets for die mounting
Thin film microcircuits are produced by depositing metallic and resistive layers onto precision ceramic substrates using high-vacuum processes — magnetron sputtering, electron-beam evaporation, or resistive thermal evaporation — followed by photolithographic patterning to define the circuit geometry. This approach yields fine conductor line widths and gaps with high dimensional accuracy, enabling highly dense circuit layouts.
The substrate surface quality is fundamental to thin film performance. Before metallization, substrates can be polished, ensuring uniform film adhesion, consistent resistor behavior, and sharp feature definition. Standard substrate materials include 96% and 99.6% alumina (Al₂O₃) and aluminum nitride (AlN); other materials<ссылка> are also available upon request.
The typical thin film stack comprises:
Thin film resistors can be formed from silicon-based alloy films with an exceptionally repeatable temperature coefficient of resistance (TCR). After deposition, resistor values are precisely adjusted by functional laser trimming to tolerances as tight as ±0.1%, making these circuits suitable for precision analog and mixed-signal designs.
Substrate preparation, laser and diamond machining, via formation, selective edge and end-face metallization, and division of panel formats into individual circuits are all performed in-house — allowing complete engineering support from initial design to finished component. A proprietary technology for forming precision cavities (recesses) in the ceramic body enables flush mounting of microwave MMICs and die components, achieving maximum die co-planarity with the metallization pattern and recess dimensional accuracy of ±5 µm.
| Parameter | Typical | Extended |
|---|---|---|
| Substrate Materials | Al₂O₃ (96%, 99.6%), AlN | Ferrite, Quartz, Sapphire and others |
| Substrate Thickness | 0.25; 0.38; 0.5; 0.63; 1.0 mm | Any custom thickness from 0.1 mm |
| Adhesion Layer | Cr | V, Ti, and other systems on request |
| Conductor Layer | Cu, 1–8 µm | Al, Au, and other systems on request |
| Barrier Layer | Ni (electro- or electroless) | — |
| Protective / Bonding Layer | Au (electroplated), 1~4 µm or ENIG / ENIPIG | |
| Film Resistors | Silicon-alloy | Other systems on request |
| Resistor Tolerance (after trimming) | ±1% | ±0.1% |
| Min. Line Width / Space | 50 µm / 50 µm | Down to 25 µm (design-dependent) |
| Metallized Vias | + | + |
| Selective Edge / End-face Metallization | + | + |
| Photoresist Protective Masks | + | + |
| Glass Protective Masks | + | + |
| Precision Cavity for MMIC Die | + | |
| Scribing, Laser & Diamond Cutting | + | + |
| Deposition Type | Material | Thickness, µm |
|---|---|---|
| Magnetron | Aluminium | 0.05~1.1 |
| Magnetron | Chromium | 0.05~0.5 |
| Magnetron | Monel | 0.05~0.5 |
| Magnetron | Vanadium | 0.05~0.2 |
| Magnetron | Niobium | 0.05~0.5 |
| Magnetron | Nichrome | 0.05~0.5 |
| Electron-beam | Niobium | 0.05~0.5 |
| Electron-beam | Vanadium | 0.05~0.2 |
| Electron-beam | Nickel | 0.1~0.5 |
| Electron-beam | Chromium | 0.05~0.5 |
| Electron-beam | Aluminium | 0.05~1.1 |
| Electron-beam | Gold | 0.05~1.0 |
| Electron-beam | Titanium | 0.05~1.0 |
| Resistive | Aluminium | 0.05~1.5 |
| Resistive | Chromium | 0.05~0.5 |
| Resistive | Nickel | 0.1~0.3 |
| Resistive | Vanadium | 0.05~0.2 |
| Resistive | Titanium | 0.05~0.2 |
| Resistive | Gold | 0.05~1.0 |
* Specific combinations can be configured to meet special electrical, thermal, or compatibility requirements. Contact our engineering team to discuss the optimal deposition stack for your application.
How do I choose the right substrate material?
Start with two parameters: dielectric constant (governs electrical performance) and thermal conductivity + CTE (critical for high-power designs where heat and mechanical stress matter). When in doubt, thicker substrates (~0.5 mm) are easier to handle and cheaper to process — departing from standard thicknesses should have a clear technical reason.
When does alumina work, and when should I switch to AlN?
Alumina is the right default for most low-to-medium power DC and microwave circuits — cost-effective, widely available, excellent surface quality. Move to aluminum nitride when thermal dissipation becomes the binding constraint: AlN offers much higher thermal conductivity and a good CTE match with silicon, making it the standard choice for high-power modules.
What substrates are best for millimeter-wave frequencies?
Fused silica and quartz — extremely low dielectric loss and, in the case of quartz, very low CTE. Sapphire is also an option when high mechanical strength or optical properties are additionally required.
Do you work with ferrites, titanates, and other specialty materials?
Yes. We process ferrite substrates for circulators and isolators, and titanate ceramics for high-dielectric-constant applications. If your material isn't in our standard list, just ask.
What are the main cost drivers for thin film substrates?
Several factors compound: material type (specialty substrates like quartz or sapphire cost more than alumina); surface finish (polished > lapped > as-fired); substrate thickness (non-standard adds cost); panel size; metallization stack (number of layers, choice of metals — Au-based systems cost more than Cu; additional plating steps add to the total); circuit complexity (line density, vias, resistor trimming requirements); and any post-processing such as dicing, edge metallization, or cavity formation. Discussing all of these early in the design process usually pays off.
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