Thick Film

Thin Film

DBC & AMB

Electro and Electroless
Plating

S-Component offers the most in-demand solutions in ceramic metallization technology. Most of your needs can be met using our core technologies:

• DBC (Direct Bonded Copper)
• AMB (Active Metal Brazing)
• DPC (Direct Plated Copper)
• Thick film hybrid technology
• Thin-film hybrid technology

Select the Request For Quote button, below, to request
a quote for your Engineering Transmission Lines Kit(s).