Company
Precision machined ceramic substrates deliver high-accuracy contour cutting, micro-drilling, and scribing for advanced electronic and technical applications. While Al₂O₃ (alumina) and AlN (aluminum nitride) are the most commonly processed materials, our machining capabilities extend to a broad range of advanced materials. We also offer diamond dicing and advanced ceramic machining techologies to ensure the optimal process for your design. The result: precision ceramic substrates engineered for performance, reliability, and cost-efficiency.
View DetailsPRECISION
Tight Tolerances
SCALABILITY
Prototype → Volume
DESIGN FREEDOM
Complex Geometries
FAST & FLEXIBLE
No Tooling; Cost-effective
Laser processing has become a preferred solution for machining ceramic substrates due to its non-contact nature, high dimensional control and ability to produce complex shapes without inducing mechanical stress. Laser cutting minimizes chipping and edge damage while enabling tight tolerances and repeatable results.
While Al₂O₃ (alumina) and AlN (aluminum nitride) are the most commonly processed materials, our machining capabilities extend to a brouad range of advanced materials
We also offer diamond dicing and advanced ceramic machining techologies to ensure the optimal process for your design. Laser machining supports:
The result is a high-accuracy ceramic substrate suitable for advanced electronic assemblies and harsh-environment components.
| Feature | Standard | Premium |
|---|---|---|
| Substrate Thickness (mm) | 0.15; 0.25; 0.38; 0.5; 0.63; 0.76; 0.89; 1.0; 1.5; 2.0 | Any from 0.05 mm |
| Thickness Tolerance | ±10% for thickness <0.63 mm; ±0.05 mm for thickness ≥0.63 mm | As per Customer Specification |
| Substrate Size | Up to 130 × 180 mm (depends on material and thickness) | Up to 300 × 300 mm and more (depends on material and thickness) |
| Camber | 0.03% per mm | As per Customer Specification |
| Scribe Line Spacing Tolerance | ±0.05 mm | ±0.025 mm |
| Post-Snap Segment Tolerance @ substrate thickness |
+0.15/-0.05 @ 0.25~0.63 mm +0.20/-0.05 @ 0.76~1.27 mm +0.35/-0.05 @ 1.50~2.00 mm |
|
| Hole Diameter Tolerance | ±0.05 mm | ±0.025 mm |
| Through-Cut Dimension Tolerance | ±0.05 mm | ±0.025 mm |
| Minimum Hole Diameter | 0.1 mm (depends on material and thickness) | 0.05 mm (depends on material and thickness) |
| Minimum Hole-to-Hole Spacing | ≥ substrate thickness | As per Customer Specification |
| Minimum Hole-to-Edge Distance | ≥ substrate thickness | As per Customer Specification |
| Minimum Corner Radius | 0.25 mm | |
| Positioning Accuracy | ±0.05 mm | ±0.025 mm |
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Submit Your Request
Please fill out the form and provide as much detail as possible. The more information you share, the more efficient our response will be.
Review & Clarification
We carefully review your specifications and may contact you for clarification. We provide as much cooperation and communication as your project requires.
Tailored Quotation
You will receive a competitive offer including pricing, estimated lead times, technical details, and, if relevant, alternative solutions.
Ongoing Support
After confirmation, we stay with you throughout production, delivery, and product use — ensuring reliable service and long-term cooperation.
Strategic Electronics Summit · BIEC, Bengaluru
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