Advanced Ceramic
Packaging Solutions

Technologies

Advanced Ceramic
Processing

  • Laser Machining, Cutting, Scribing, Drilling
  • Laser Ablation, Laser Marking
  • Diamond Dicing and Profiling
  • Lapping and Polishing

Metallization

  • Thick Film
  • Thin Film
  • DBC & AMB
  • Electro and Electroless Plating

Hybrid Assembly

  • Design & Engineering
  • Die Attach
  • Wire Bonding
  • Sealing/Encapsulation

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