Company
Ceramic PCBs combine excellent thermal conductivity, mechanical stability, and dielectric reliability in a single high-performance substrate. Unlike traditional FR-4 or MCPCB, ceramic printed circuit boards are engineered for high-power, high-frequency, and harsh-environment applications where heat dissipation and dimensional stability are critical.
We manufacture ceramic PCBs based on alumina (Al₂O₃), aluminum nitride (AlN), and other advanced ceramic materials using different metallization technologies to deliver precision, reliability, and long service life.
HIGH TEMPERATURE
Far beyond 300°C
HARSH ENVIRONMENTS
Moisture, chemicals, vibration
HEAT MANAGEMENT
Maximum power density
INTEGRATION LEVEL
Chip-on-board ready
Ceramic printed circuit boards use inorganic substrates instead of organic laminates, providing superior thermal conductivity, dimensional stability, dielectric strength, and high-temperature performance. They are engineered for applications where conventional FR-4 or MCPCB technologies reach their limits — high power density, elevated temperatures, aggressive environments, and long service life.
Ceramic PCB technology goes beyond a simple material substitution. Substrate selection, metallization system, geometry, and production approach are closely interconnected and should be evaluated together to achieve the best technical and commercial outcome. Our engineering team supports customers at every stage, helping define the most balanced and efficient solution for each specific application. For practical design guidance, explore the Design Considerations in the Specifications tab.
| Parameter / Technology | Thin Film | Thick Film | DBC | DPC |
|---|---|---|---|---|
| Adhesion Layer | Cr, V, Ti | – | – | Ti, Cr |
| Conductor Layer | Sputtered Cu, Al Au, Ag, Ti (optional) |
Ag, Au, Ag-Pd, Ag-Pd-Pt, Ni | Oxygen-free Cu foil | Electroplated Cu |
| Finish / Protective Layer | ENIG, ENIPIG, Ni, Au | ENIG, ENIPIG, Ni, Au | Supported, not typical | ENIG, ENIPIG (Std.) Ni/Au supported |
| Printed / Film Resistors | Silicon-based alloys | Ruthenium pastes | – | – |
| Dielectric Protective Coating | + | + | + | + |
| Solder Mask | + | + | + | + |
| Conductor Thickness (µm) | 1~30 | 10~50 | 100~400 (up to 1000) | 10~100 |
| Min Line / Space (µm) | 50 / 50 | 75 / 75 | 150 / 150 | 75 / 75 |
| Metallized Vias | + | + | – | + |
| Solid Filled Vias | + | + | – | – |
| Through / Mounting Holes | + | + | + | + |
| Edge Metallization | + | + | – | – |
| Max Soldering Temperature (°C) | 850 | 450 | 850 (≤400°C operation) | 850 |
| Typical Substrate Materials | See Materials | See Materials | 96% Al₂O₃, AlN, Si₃N₄ | 96% / 99.6% Al₂O₃, AlN |
| Substrate Thickness (mm) | 0.15~2.0+ | 0.15~2.0+ | 0.25; 0.38; 0.63; 1.0 | 0.25; 0.38; 0.5; 0.63; 1.0 |
| Category | Design Aspect | Recommendation | Engineering Rationale |
|---|---|---|---|
| Cost Control | Development | Involve us early | Optimizes cost, yield, and production scalability |
| Cost Control | Material selection | Use 96% Al₂O₃ with thick film (Ag) metallization for standard applications | Balances cost and heat dissipation requirements |
| Cost Control | Mechanical | Board size ~100×100 mm or less is often most cost-efficient | Improves material yield and handling stability |
| Cost Control | Mechanical | Via strategy: Optimize via count; avoid excessive vias | Lowers cost and preserves mechanical strength |
| Mechanical | Corner geometry | Avoid sharp internal corners; use fillets | Reduces crack initiation risk |
| Mechanical | Hole spacing | Hole-to-hole and hole-to-edge ≥ substrate thickness (or more, unless validated) | Minimizes stress concentration |
| Electrical | Metallization choice | Thick film for cost efficiency and variety of features; thin film for the finest features; DBC/DPC for high current | Aligns performance with manufacturing method |
| Electrical | High current layout | Widen traces, use parallel conductors, large pads | Reduces resistive losses and overheating |
| Integration | COB readiness | Design die-attach pads and compatible surface finish | Enables reliable bare-die assembly |
| Integration | CTE matching | Match substrate and joining materials | Reduces solder fatigue and long-term failure |
| Manufacturing | Finish plating | Select finish based on soldering or wire bonding method | Ensures assembly reliability |
How are ceramic PCBs different from conventional PCBs?
Ceramic PCBs are not just a material swap. They require a different design mindset, considering thermal management, mechanical stability, and metallization options. Early design modifications can improve reliability, reduce cost, and simplify production.
What is the first step when switching to ceramic PCBs?
Start with a conversation. Discuss your requirements, sketches, or concepts with our engineers to get practical recommendations for cost-effective, reliable, and ceramic-optimized designs.
Which ceramic materials are commonly used?
How does geometry and layout affect ceramic PCB design?
Smart geometry is critical. Consider:
What metallization options are available?
Ceramic PCBs offer multiple options:
How do I choose the right metallization?
The choice depends on technical requirements, production strategy, and budget. INCERAM provides guidance to balance cost, performance, and manufacturability.
Can ceramic PCBs support bare-die and high-power applications?
Yes. Ceramic substrates are ideal for chip-on-board (COB) integration, high-power modules, and designs requiring superior thermal performance.
Why involve engineers early in the design?
Early consultation ensures optimal material selection, PCB geometry, and metallization, maximizing reliability, minimizing cost, and unlocking the full benefits of ceramic technology.
Are ceramic PCBs more expensive than FR-4?
Material and processing costs are higher, but smart design and early engineering input can reduce total system costs by improving reliability, thermal management, and reducing additional cooling requirements.
Submit Your Request
Please fill out the form and provide as much detail as possible. The more information you share, the more efficient our response will be.
Review & Clarification
We carefully review your specifications and may contact you for clarification. We provide as much cooperation and communication as your project requires.
Tailored Quotation
You will receive a competitive offer including pricing, estimated lead times, technical details, and, if relevant, alternative solutions.
Ongoing Support
After confirmation, we stay with you throughout production, delivery, and product use — ensuring reliable service and long-term cooperation.
Strategic Electronics Summit · BIEC, Bengaluru
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