Ceramic Substrates
Custom ceramic components combining thermal, electrical, and mechanical performance — from thermal interfaces to structural parts.
Company
Proud ELCINA Member
Electronic Industries Association of India
Product categories
Choose the level of integration you need — from precision ceramic substrates to metallized circuits and fully engineered hybrid modules.
Custom ceramic components combining thermal, electrical, and mechanical performance — from thermal interfaces to structural parts.
Ceramic PCBs, microheaters, sensors, and thick/thin film microcircuits with stable electrical performance and robust thermal management.
Fully integrated custom modules and multi-chip assemblies built on metallized ceramic substrates.
Product portfolio
INCERAM designs and manufactures advanced ceramic products for electronics that must perform where standard materials fail — under extreme heat, high voltage, vibration, and chemical exposure. Our range spans three core categories. Ceramic Substrates — including thermal interfaces, laser-cut substrates, and structural ceramic components — provide the mechanical and thermal foundation for demanding assemblies. Metallized Ceramics — ceramic PCBs, microheaters, ceramic sensors, thick film and thin film microcircuits, and custom DBC substrates — combine ceramic's stability with functional conductive layers for real circuit integration. Hybrid Assemblies — custom hybrid micromodules and multi-chip power modules — bring these building blocks together into complete, application-specific solutions. Every product is built from advanced materials such as Al₂O₃, AlN, Si₃N₄, and other ceramics, and manufactured using laser machining, diamond dicing, thick and thin film metallization, and DBC/DPC technologies. Whether you need a single component or a fully engineered module, our team works with you from concept to volume production.
Performance
Across our entire portfolio, ceramic-based products deliver properties that organic PCB materials and standard packaging simply cannot match. Thermal conductivity reaches up to 230 W/m·K — several times higher than FR-4 or MCPCB — enabling compact designs with maximum power density. Operating ranges extend from below −200°C to over 850°C for soldering and brazing processes, with dielectric strength above 15 kV/mm and volume resistivity exceeding 10¹⁴ Ω·cm. Combined with low thermal expansion, high mechanical strength, and resistance to chemicals and corrosion, these properties make our products the reliable choice for automotive, aerospace, defense, and industrial electronics operating in harsh environments.
Heat spreading that keeps power density high without thermal runaway.
Up to 230 W/m·KHigh dielectric strength and resistivity for safe high-voltage designs.
>15 kV/mm · >10¹⁴ Ω·cmStable operation from cryogenic conditions through high-temperature processing.
−200°C to 850°C+Low CTE, high strength, and chemical resistance for harsh-environment duty.
Built for long service lifeManufacturing technologies
INCERAM combines a broad set of manufacturing technologies to match each product to its application, rather than forcing a single process onto every design. Laser machining enables precision contour cutting, micro-drilling, ablation, scribing, and singulation of ceramic substrates with minimal chipping and tight tolerances. Diamond dicing delivers ultra-precise straight cuts, slots, cavities and high-density part arrays with clean, burr-free edges for both prototypes and volume production. Advanced CNC ceramic machining handles complex 3D geometries, pockets, and structural features. For electrical functionality, we apply thick film screen-printing for cost-effective, multilayer circuits with printed resistors; thin film vacuum deposition and photolithography for the finest conductor geometries and RF performance; and Direct Bonded Copper (DBC) for high-current, high-power designs. Ceramic-to-ceramic bonding using proprietary glass formulations enables hermetic, mechanically stable assemblies, while wire bonding, die attach, and encapsulation complete the transition from bare substrate to functional module. This is what allows us to move seamlessly from single ceramic components to fully integrated hybrid assemblies. Explore our Technologies section for details on each process.
Contour cutting, micro-drilling, ablation, scribing, and singulation with tight tolerances.
Clean, burr-free cuts, slots, and cavities for dense part arrays at any volume.
Complex 3D geometries, pockets, and structural features beyond planar blanks.
Screen-printed multilayers or vacuum-deposited fine conductors for RF and precision circuits.
Direct bonded and plated copper for high-current, high-power thermal designs.
Die attach, wire bonding, ceramic bonding, and encapsulation into ready modules.
Industries
INCERAM's ceramic substrates, metallized ceramics, and hybrid assemblies are customized and produced for industries where failure is not an option. From power electronics that must dissipate extreme heat, to defense and aerospace systems that must survive vibration, shock, and decades of service in the field, our products are selected wherever conventional components, PCB and packaging materials reach their technical limits. Because ceramic properties — thermal conductivity, dielectric strength, and mechanical stability — translate directly into system reliability, our components are increasingly specified early in the design process rather than as a late-stage fix.
Power modules, sensors, and control electronics under thermal and vibration stress.
High-current conversion and dissipation where FR-4 and MCPCB reach their limits.
Long-life packaging for shock, vibration, and extreme environmental duty cycles.
Stable ceramic platforms for dense interconnects and thermal management.
Low-loss metallized ceramics for high-frequency signal integrity.
Thermally stable substrates for lighting and optical electronics assemblies.
Reliable ceramic parts for devices that demand stability and cleanliness.
Instrumentation and sensors that must stay accurate in harsh plant conditions.
How we work
Every INCERAM product follows a structured path from application requirement to finished part. We start with a technical conversation about your electrical, thermal, and mechanical requirements — the earlier we're involved, the more we can optimize cost and reliability. Based on this, our engineers select the right substrate material and manufacturing technology, whether that's laser-cut alumina, thick film aluminum nitride, or a fully custom hybrid module. Prototypes are produced first to validate design and performance; the same equipment and process then scale directly into series production, so nothing changes between qualification and volume supply. Throughout, in-house capabilities — substrate machining, metallization, assembly, and testing — keep quality and lead times under our own control rather than dependent on multiple external vendors. The result: a repeatable, cost-efficient path from concept to a fully qualified, ready-to-integrate product.
Electrical, thermal, and mechanical needs clarified early to lock the right design path.
Substrate and technology matched to performance, cost, and manufacturability.
Engineering samples built on production equipment before series release.
In-house machining, metallization, assembly, and testing through volume supply.
Why INCERAM
INCERAM combines decades of ceramic packaging expertise from Europe and Russia with dedicated local manufacturing built for India's growing electronics industry. As a member of ELCINA, we are directly engaged with India's electronics manufacturing ecosystem. Our engineering-first approach means every product is matched to its application rather than forced into a standard catalog part, with full support from material selection through prototyping, qualification, and volume production. Fast turnaround, competitive pricing, and in-house control over machining, metallization, and assembly let us offer solutions other manufacturers can't — from low-volume prototypes to full-scale production — without compromising the reliability that automotive, aerospace, defense, and semiconductor customers require.
Deep ceramic packaging know-how applied to India's electronics manufacturing ecosystem.
In-house machining, metallization, and assembly under one controlled process chain.
Prototype-to-volume continuity on the same equipment to reduce requalification risk.
Custom, application-matched solutions from concept through series production.
FAQ
Ceramic substrates are the base ceramic components — machined, cut, or shaped from materials like alumina or aluminum nitride — used mainly for thermal management or structural purposes. Metallized ceramics take these substrates further by adding conductive layers (thick film, thin film, DBC, etc.), turning them into functional circuits such as ceramic PCBs, sensors, or hybrid microcircuits.
It depends on your priorities. 96% alumina is the most cost-effective baseline for general applications. Aluminum nitride (AlN) is chosen when thermal dissipation is critical. Silicon nitride (Si₃N₄) offer the best mechanical strength and thermal cycling life for the most demanding environments. Our engineering team will recommend the right material once we understand your requirements.
Yes. We regularly produce single prototypes and engineering samples as well as small and large series, using the same processes and equipment for both — so there is no re-qualification risk when scaling up.
Yes. All our products can be customized in size, thickness, shape, and metallization system, including a wide range of features, tailored to your application.
Automotive, semiconductors, optoelectronics, microwave/RF, aerospace, and defense are our core markets, alongside industrial, medical, and telecom applications wherever high reliability under harsh environments is required.
Fill out the quote request form below with your requirements and any relevant drawings or specifications. Our team responds within one business day.
Next step
Submit Your Request
Please fill out the form and provide as much detail as possible. The more information you share, the more efficient our response will be.
Review & Clarification
We carefully review your specifications and may contact you for clarification. We provide as much cooperation and communication as your project requires.
Tailored Quotation
You will receive a competitive offer including pricing, estimated lead times, technical details, and, if relevant, alternative solutions.
Ongoing Support
After confirmation, we stay with you throughout production, delivery, and product use — ensuring reliable service and long-term cooperation.
Prefer email? Write to sales@inceram.in or call +91 93199 62859.
Strategic Electronics Summit · BIEC, Bengaluru
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