Across our entire portfolio, ceramic-based products deliver properties that organic PCB materials and standard packaging simply cannot match. Thermal conductivity reaches up to 230 W/m·K — several times higher than FR-4 or MCPCB — enabling compact designs with maximum power density. Operating ranges extend from below −200°C to over 850°C for soldering and brazing processes, with dielectric strength above 15 kV/mm and volume resistivity exceeding 10¹⁴ Ω·cm. Combined with low thermal expansion, high mechanical strength, and resistance to chemicals and corrosion, these properties make our products the reliable choice for automotive, aerospace, defense, and industrial electronics operating in harsh environments.

INCERAM combines a broad set of manufacturing technologies to match each product to its application, rather than forcing a single process onto every design. Laser machining enables precision contour cutting, micro-drilling, ablation, scribing, and singulation of ceramic substrates with minimal chipping and tight tolerances. Diamond dicing delivers ultra-precise straight cuts, slots, cavities and high-density part arrays with clean, burr-free edges for both prototypes and volume production. Advanced CNC ceramic machining handles complex 3D geometries, pockets, and structural features. For electrical functionality, we apply thick film screen-printing for cost-effective, multilayer circuits with printed resistors; thin film vacuum deposition and photolithography for the finest conductor geometries and RF performance; and Direct Bonded Copper (DBC) for high-current, high-power designs. Ceramic-to-ceramic bonding using proprietary glass formulations enables hermetic, mechanically stable assemblies, while wire bonding, die attach, and encapsulation complete the transition from bare substrate to functional module. This is what allows us to move seamlessly from single ceramic components to fully integrated hybrid assemblies. Explore our Technologies section for details on each process.

INCERAM combines decades of ceramic packaging expertise from Europe and Russia with dedicated local manufacturing built for India's growing electronics industry. As a member of ELCINA, we are directly engaged with India's electronics manufacturing ecosystem. Our engineering-first approach means every product is matched to its application rather than forced into a standard catalog part, with full support from material selection through prototyping, qualification, and volume production. Fast turnaround, competitive pricing, and in-house control over machining, metallization, and assembly let us offer solutions other manufacturers can't — from low-volume prototypes to full-scale production — without compromising the reliability that automotive, aerospace, defense, and semiconductor customers require.